As we begin this new year, we wanted to take a moment to thank all of you who joined us in November for the Networking Event and General Assembly in Paris
IPCEI Microelectronics and Communication Technologies
EDITO
Dear IPCEI ME/CT community,
Happy New Year!
As we begin this new year, we wanted to take a moment to thank all of you who joined us in November for the Networking Event and General Assembly in Paris. It was a pleasure to meet many of you in person and to share insights about the work we’ve been doing alongside the Transformers Group (TG) and Facilitation Group (FG).
We're also delighted to have kick-started communication initiatives in 2024, and we’re here to support you in 2025!
2024 Key Milestones from the IPCEI ME/CT Work Streams
Exploration & development of eco-friendly materials and specific equipment to enable high volume high yield manufacturing of eco-friendly innovative smart sensors.
Some component development highlights: first evaluation of system performance of HW & SW for ML acceleration operating UWB radar qualification algorithms ; a product validation for 3Di, cognitive detection and a new high-resolution imager ; a SWIR environmental observation sensor prototype as delivered to ESA ; a leading-edge prototype UV-C LED with outstanding results on extraction efficiency (EQE) and light output power.
A first functional prototype of a novel modular and flexible reference measurement system for ADAS/AD sensor and system validation has been set up. Two test cars for ultrasonic vision have been configured to improve data collection to train AI models and to verify the models in real street traffic.
Prototype car on which new sensing elements will be tested.
SENSE: Advancing Sensors for European Microelectronics Innovation
Join Patrick Pype, Director of Strategic Partnerships at NXP Semiconductors, as he delves into the SENSE workstream and its role in advancing sensors within the European microelectronics ecosystem.
Highly innovative projects have been started along the entire value chain from precursor materials up to systems in application domains.
Correspondingly, the technical achievements cover an extremely wide technical field from semicon manufacturing equipment to post quantum cryptography.
First projects have reached the FID including the erection of new buildings.
Several projects, especially from SMEs, are developing tools and HW and SW solutions based on RISC-V.
THINK: Microelectronics for Secure and Sustainable Data Storage
In this video, Sandra EGER, Head of Public Funding at AT&S, presents the THINK workstream, a key part of the IPCEI ME/CT initiative. This workstream focuses on advancing energy-efficient and secure microelectronics for data processing and storage.
TechTalk, February 8-9, 2024, Barcelona, Spain; co-organized by AVL List, STMicroelectronics, NXP, SINTEF, Infineon, and Teraglobus.
Workshop dedicated to Electronics Components and Systems for the sectors of mobility and energy; several interactive sessions about power electronics.
The 19th International Conference on
“PhD Research in Microelectronics and Electronics” (PRIME 2024)
The 19th International Conference on “PhD Research in Microelectronics and Electronics” (PRIME 2024) was held in Larnaca (Cyprus) from June 9-12, 2024.
The conference brought together more than 100 attendees from 15 countries and provided the opportunity to promote internship offers for students and PhD research project possibilities on subjects in the microelectronics domain.
PRIME 2024 was a great opportunity for strengthening both relations with non-IPCEI participants and links among IPCEI ME/CT participants (Infineon, ST and FBK) within the dynamic framework of IPCEI ecosystem.
With respect to the WS ACT technical topics, ST held an industrial talk titled “BCD, High Voltage Technology and Medical Echography” and ran a booth, showcasing IPCEI tablecloth, rollup and gadgets.
Hundreds of students from both IPCEI and non-IPCEI countries presented their PhD dissertations.
Construction of state-of-the-art 300mm Silicon wafers infrastructure ready to use for First Industrial Deployment phase in Italy.
RF mmWave CMOS solutions on FD-SOI and RF-SOI for expanded range and power efficiency.
Disruptive Wide Band Gap substrates using the Smart Cut technology (SmartGaN) and devices (GaN on SiC HEMT) enabling high frequency domains initiated.
Highly innovative JU value chain projects (Move2THz or photonixLab) fostering new InP or photonics technological platforms compatible with high industrial volumes.
Versatile and high-throughput on-wafer test setup for MMIC measurement in the D-band (110 GHz - 170 GHz).
2024 Key Communication Actions from the TG/FG/ABGI
#Spring 2024
Initial reporting on spillover activities.
Launch of the IPCEI ME/CT website and social media channels.
First newsletter and first webinar on the IPCEI ME/CT.
#Summer 2024
Enhanced website with full features.
4 TG/FG video interviews showcasing the IPCEI ME/CT initiative.
Collaborating for Progress: IPCEI ME/CT and Europe's Tech Sovereignty
Understanding the IPCEI Framework for European Microelectronics
Maximizing Spill-Over Activities Across Europe with IPCEI ME/CT
How IPCEI ME/CT Drives European Growth and Competitiveness?
Second webinar: role of RTOs in the microelectronics and telecommunication industry.
Successful Networking Event on sustainability in the field, including poster sessions and roundtables.
General Assembly IPCEI ME/CT (and final GA IPCEI ME).
The Semiconductor Rendez-Vous – Prague – Oct. 8-10, 2024, devoted to the IPCEI ME/CT, was organized by ST France, Soitec and Lynred, with the participation of ST Italy, ST Malta, Renault, Valeo, Vitesco, Murata, CEA, Aledia, X-FAB, GlobalWafers, Czech Technical University and four local organizations, Codasip, Microft Mind (DP), NXP and Prague University (AP) also participated. The involvement of Minalogic and the Czech National Semiconductor Cluster were also instrumental. Demos of ST, Lynred, X-Fab, Soitec, Valeo, Global Wafers,Aledia, overall IPCEI presentations by the FG speaker F. Bell and VDI/VDE representative Nicolas Gouze complemented the rich program, concluded by Pierre Chastanet from the European Commission (DG CNECT) on the place of the semiconductor industry in Europe. Overall, 30 speakers, 20 result presentations, 4 panel discussions, 7 partners’ booths, and 150+ participants from 7 countries (Czechia, France, Italy, Germany, Malta, Slovakia, UK) made this event a great success.
#Winter 2024
Kick-off of the 2025 communication plan, starting with this newsletter, setting the tone for another exciting year ahead!
