2 Events + 1 Semiconductor Ecosystem = Unlimited Opportunities to Connect. 

On Wednesday, June 17, 2026, IPCEI ME/CT CONNECT is back for a special edition in Dresden, Germany, hosted at Dresden Airport alongside the 20th Silicon Saxony Days (SSD) one of Europe’s flagship gatherings for microelectronics and semiconductor innovation. 

For one morning concluding the SSD, Europe’s semiconductor ecosystem will come together to exchange ideas, showcase breakthrough technologies, and build new collaborations across the value chain.  

A strategic event for a strategic value chain in Europe 

Industry leaders, technology experts, research organisations, and institutional representatives will share the latest advances emerging from the SENSE, THINK, ACT, and COMMUNICATE workstreams through keynote talks, short pitches, networking moments, and interactive discussions. 

Beyond the conference sessions, CONNECT 2026 is also an opportunity to increase the visibility of ongoing projects and meet the people behind them. A dedicated selection of IPCEI ME/CT posters will be showcased throughout the entire Silicon Saxony Days event, from Monday to Wednesday, creating continuous opportunities for exchanges, networking, and discovery during all three days. 

Preliminary Agenda 

09:00 – Poster Walk & Opening 

Opening Session 

Time	Session	Speaker	Organisation
09:30	Opening Greetings	Daniel Lukas	Federal Ministry for Economic Affairs and Energy, Germany
09:40	Keynote Address	Manfred Horstmann	General Manager & Senior Vice President, GlobalFoundries Europe
10:00	Introduction to IPCEI ME/CT	Ferdinand Bell	NXP

Technology Highlights & Short Talks 

Time	Topic	Speaker	Organisation	Workstream
10:10	XT011 – X-FAB’s Next Generation 110 nm BCD on SOI Technology Platform	Lars Bergmann	X-FAB	SENSE
10:20	The New Frontiers of Semiconductor Metrology	Roberto Pangallo	WOOPTIX S.L.	SENSE
10:30	Advanced Material Solutions for Low-Power Edge AI and Packaging	François Brunier	SOITEC	THINK
10:40	Prevent the Cybersecurity Debacle: Building Security into Chips	Mike Eftimakis	Codasip / CHERI Alliance	THINK
10:50	Millimeter-Wave Converters Enabled by Novel GaN-on-SiC HEMT Technology	Robert Makon	Rohde & Schwarz	COMMUNICATE
11:00	System-on-Chip Power Saving Evolution for 6G	Mirel Pehadzic	Nokia Mobile Infrastructure	COMMUNICATE
11:10	TBA	Dirk Brauer	Valeo	ACT
11:20	High-Performance Nanowire MicroLEDs for Optical Interconnects	Ivan-Christophe Robin	Aledia	ACT
11:30	IPCEI ME/CT Spillover Highlights	Stefan Wunderer	Nokia

Closing Session 

Time	Session	Speaker
11:40	Closing Remarks	Ferdinand Bell (NXP)
11:45	Poster Walk & Networking around fingerfood

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