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Funding

Have you been funded by the IPCEI ME/CT? Congratulations! But perhaps you’re looking for additional funding for your microelectronics and communication technology projects to maximize your research outcomes? You’re in the right place.

DIGITAL-JU-CHIPS-2025-SG-LFA – Lab to Fab Accelerators for Advanced Packaging and Heterogeneous Integration

Publication date: 03 December 2025
Call opening date: 03 December 2025
Closing date: 25 February 2026 – 17:00 (GMT +2)

This call supports Lab to Fab Accelerators through Simple Grant (SG) actions under the Digital Europe Programme, with the objective of accelerating the industrial deployment of advanced packaging and heterogeneous integration technologies in Europe.

Funded projects are expected to strengthen the transition from research and pilot lines to manufacturing, by supporting mature, industry-driven initiatives addressing bottlenecks in areas such as advanced packaging, chiplets, and system integration. The call contributes directly to reinforcing the European semiconductor value chain, improving competitiveness, scalability, and resilience.

Actions should demonstrate a high level of maturity and readiness, with a strong focus on implementation, impact, and alignment with the Chips JU Work Programme 2023–2027, notably under the Chips for Europe Initiative.

Key objectives include:

  • Contributing to Europe’s strategic autonomy in microelectronics
  • Accelerating the transition from lab-scale innovation to industrial production
  • Supporting advanced packaging and heterogeneous integration capabilities
  • Strengthening European semiconductor manufacturing ecosystems
  • Reducing technological and financial barriers to scale-up
More information

DIGITAL-JU-CHIPS-2025-CSA-LFA – Lab to Fab Accelerator Ecosystem (CSA)


Closing date: 25 February 2026 – 17:00 (GMT +2)

This call supports Coordination and Support Actions (CSA) under the Digital Europe Programme, with the objective of strengthening the Lab to Fab Accelerator ecosystem in Europe. It focuses on boosting cooperation across the semiconductor value chain, particularly to accelerate the industrial implementation of advanced packaging, chiplets, and heterogeneous integration technologies.

Funded actions will contribute to structuring, coordinating, and aligning stakeholders at European and national levels, supporting knowledge transfer from research to industrial deployment. The call targets activities such as ecosystem coordination, strategic planning, networking, dissemination, standardisation support, and policy dialogue, in line with the Chips Joint Undertaking Work Programme 2023–2027.

Key objectives include:

  • Strengthening cooperation between research, industry, and innovation actors
  • Accelerating the transition from laboratory research to industrial manufacturing
  • Supporting advanced packaging, chiplets, and heterogeneous integration ecosystems
  • Enhancing European strategic autonomy in semiconductor technologies
  • Improving visibility, coordination, and impact of EU-funded initiatives
More information

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