📍 Venue: marinaforum, Regensburg, Germany
📅 Dates: April 11–14, 2027

28th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems

Advancing microelectronics reliability through multiphysics simulation and experimental validation

EuroSimE 2027, the 28th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems, will take place in Regensburg, Germany, from 11 to 14 April 2027. The conference will bring together experts from industry and academia to share advances in modelling, simulation and experimental methods for microelectronics, nanoelectronics and microsystems.

As semiconductor technologies evolve towards increasingly complex architectures, advanced packaging and heterogeneous integration, understanding the interactions between thermal, mechanical and electrical phenomena is essential to improving component performance, reliability and lifetime.

EuroSimE provides an international forum for researchers, engineers, semiconductor manufacturers, equipment suppliers and technology developers to present their latest results, discuss industrial challenges and explore innovative approaches to the design, qualification and reliability of electronic components and systems.

The 2027 edition will combine technical presentations, keynote talks, poster sessions, professional development courses and an exhibition showcasing experimental characterisation equipment and simulation and optimisation software.

Key topics and highlights

• Thermal and mechanical simulation: Explore modelling approaches addressing heat transfer, thermo-mechanical stresses, vibration, shock and interactions between chips, packages and circuit boards.
• Advanced packaging and heterogeneous integration: Examine simulation and modelling methods for 3D packaging, chiplets, through-silicon vias (TSVs) and increasingly integrated electronic systems.
• Reliability, materials and experimental validation: Discover techniques for material characterisation, failure analysis, damage modelling and the experimental validation of simulation models.
• Multiphysics and multiscale modelling: Investigate coupled physical phenomena, integrated process modelling, virtual prototyping and simulation-based optimisation.
• Emerging methods and digital technologies: Explore digital twins, artificial intelligence and machine learning applied to modelling, simulation and reliability assessment.
• Applications across strategic industries: Discuss advances relevant to automotive, aerospace, energy, medical technologies, MEMS, optoelectronics and consumer electronics.

These topics reflect the technical scope outlined in the official EuroSimE 2027 call for papers.

Connecting research and industry

EuroSimE offers a focused environment for exchanging knowledge between the scientific community and industrial stakeholders working on the next generation of microelectronic components and systems.

For semiconductor manufacturers, packaging specialists, materials suppliers, simulation software developers and research organisations, the conference provides opportunities to:

• Share research findings and industrial case studies with an international technical audience.
• Identify modelling and experimental approaches to improve the reliability of electronic components.
• Explore solutions to thermal management and mechanical integrity challenges in advanced packaging.
• Develop collaborations between research teams, technology providers and industrial end users.
• Discover new tools and methodologies for simulation-driven design, validation and qualification.

The accompanying exhibition also offers suppliers an opportunity to showcase their technologies and connect with specialists in microelectronics and microsystems.