27th International Conference on Thermal, Mechanical and Multi-Physics
Simulation and Experiments in Microelectronics and Microsystems

Date: April 19-22 2026
Location: Warsaw, Poland

The conference will address results of fundamental research and industrial applications for thermal, mechanical, and multiphysics simulation and experiments of micro/nano-electronics and microsystems.

Professional training courses will be offered on April 19, 2026 followed by three days of technical sessions (April 19–22, 2026) comprising of oral and poster presentations, including industry keynote talks by invited speakers. In addition, technical keynote talks will address pressing issues in modeling and experimentation for microelectronics and microsystems. In the accompanying exhibition suppliers of experimental characterization equipment and simulation/optimization software will showcase their latest features.